Nowadays, the fabrication of integrated parts from different materials or composite parts using joining or additive manufacturing techniques is widely investigated. Many studies have focused on bonding oxide ceramics like aluminum oxide to itself and carbide ceramics like silicon carbide to itself. This research examines the bonding mechanisms of two types of ceramics, silicon carbide, and aluminum oxide, using a copper metal layer and the creation of intermediate layers between the metal and ceramic layers composed of raw materials in the ceramic phase. The spinel structure for the interface of copper and aluminum oxide and the Cu-SiC mechanical alloy composite for the interphase of copper and silicon carbide have been investigated, with both layer thicknesses being less than 1 micrometer. The solid-state diffusion process is used to connect the parts in this research. The structure, microstructure, and mechanical properties of the manufactured samples have been investigated using X-ray diffraction (XRD), scanning electron microscopy (SEM), X-ray energy dispersive spectroscopy (EDS), and bending tests. According to the results, the flexural strength in the interphase is 190 N/mm², which has significantly increased compared to previous research. Finally, it can be concluded that applying the appropriate intermediate layers results in a well-established connection.
Type of Study:
Research |
Subject:
Structural Oxide and Non-Oxide Ceramics Received: 2024/05/21 | Accepted: 2024/07/10